At the heart of computational modelling are the mathematical equations that describe the physical processes taking place during manufacture and influence the product when it is in service. For example, one of these processes could be the transfer of heat from a chip to its surroundings. These equations relate the physics of the process to external influences taking place. These include the governing classical equations of physics for fluid flow, heat transfer, stress and electromagnetics.
Numerical techniques, such as the finite element method, are used to discretise these mathematical equations that are usually represented by partial differential equations representing the governing physics taking place, and the behaviour of the materials that make up the electronic or photonic device. Continuum mechanics modelling tools can be classified as:
• computational fluid dynamics (CFD), solving phenomena such as fluid flow, heat transfer, combustion and solidification
• computational solid mechanics (CSM), solving deformation, dynamics, stress, heat transfer, and failures in solid structures
• computational electromagnetics (CEM), used to solve electromagnetics, electro-statics and magneto-statics.
What you'll learn